Headline: Prepare Your Build: AMD Readies New Ryzen 9000F Series (9700F & 9500F) and the Critical Role of High-Performance Thermal Paste
A new leak has emerged, confirming earlier rumors about AMD's expansion of its next-generation desktop CPU lineup. Earlier this month, information from motherboard makers indicated that AMD will introduce a new Ryzen 7 9700F processor. This eight-core CPU is supposedly based on Granite Ridge silicon, which means it is not using Strix Point or previous-generation Phoenix APUs. As a result, this processor will offer the full CPU configuration but will lack integrated graphics, which are usually located in the I/O die (only two RDNA2 CUs).
Apparently, this eight-core CPU is not the only one being worked on. A new entry on Geekbench shows that there is also a six-core Ryzen 5 9500F CPU incoming. Geekbench confirms that this is Granite Ridge, so we are most likely looking at a Ryzen 5 9600 with lower clocks and without iGPU support.
The leak confirms that the CPU will feature a boost clock up to 5050 MHz, so it may be either a 5.1 GHz or 5.0 GHz boost officially. This is 150 to 200 MHz lower than the Ryzen 5 9600. This strongly suggests that the CPU has a 65 W TDP at most.
AMD has not yet confirmed plans to launch the Ryzen 9000F series. However, board partners have hinted that July AGESA updates already support these CPUs. The launch may be imminent.
Maximizing Your New AMD Ryzen 9000F CPU Requires Superior Cooling
The launch of the Ryzen 7 9700F and Ryzen 5 9500F highlights a continued trend towards powerful, discrete CPUs that rely solely on dedicated graphics cards. Without an integrated GPU, the entire focus is on raw processing power. To sustain high boost clocks like the 5.05GHz noted on the 9500F and ensure system stability, effective heat dissipation is not just recommended; it is absolutely critical. Even with a 65W TDP, heat concentration can throttle performance and hinder the full potential of your new hardware.
The cornerstone of any effective cooling solution, whether using a premium air cooler or an AIO liquid cooler, is the thermal interface material (TIM). A subpar thermal paste can create insulating air gaps between the CPU's heat spreader and your cooler's cold plate, leading to higher operating temperatures, louder fan noise from increased cooling demand, and potential performance loss due to thermal throttling.
